Systems on Silicon Manufacturing

Systems on Silicon Manufacturing (SSMC) operates an 8-inch wafer fabrication facility in Pasir Ris, Singapore, delivering foundry and specialty wafer manufacturing. Founded in December 1998 as a joint venture between NXP Semiconductors and TSMC, the fab began manufacturing in 2000 and runs on SMIF-based cleanroom isolation, automated wafer-handling equipment, and proven process flows. For engineers working on robotics and automation, the relevant surface is the tooling and material-handling layer: equipment automation and process control sit alongside the process technology itself rather than being outsourced. The process portfolio spans CMOS, Embedded Flash, Analog, High Performance Mixed Signal, RF, BCD, and Sensor technologies, with feature sizes from 0.25 micron to 0.11 micron. Output targets connected cars, secure connectivity, portable and wearable devices, and IoT applications. Sensor process technology is part of the portfolio, so device-level work in that area sits near the fab's own process R&D effort. SSMC states a focus on automotive-quality wafers and on expanding its process technology portfolio through investment in an R&D center. Automating handling, inspection, and process control at those feature sizes is the operational context; the stated constraints are cost-effectiveness, flexibility across process nodes, and reliability against automotive-grade quality standards.